Foldable Smartphone Thermal Cooling

 

 

1
5G flagship, gaming and foldable smartphones face inherent conflicts between high power consumption and ultra-thin structural design. Major heat sources include main SoC, 5G RF chips and fast charging PMICs. When running heavy mobile games, recording HD videos or using high-power fast charging over 65W simultaneously, local chip temperature will reach 48-51℃. Concentrated heat will trigger processor thermal throttling, causing frame drops and fast charging power reduction, and lead to noticeable local hot spots on phone back covers. Conventional graphene films and thin copper foils only support vertical heat conduction with limited heat spreading performance, failing to disperse concentrated hotspots. Besides, their thickness cannot fit the compact internal stacking space of foldable devices.
2

Pioneer Thermal ultra-thin vapor chambers adopt mature copper etching and powder capillary sintering technology. The standard mass production thickness ranges from 0.25mm to 0.35mm, with an ultra-thin limit of 0.22mm, matching compact stacking requirements of straight and foldable smartphones. Adopting internal working fluid phase-change heat transfer, its lateral heat spreading capacity is 3 to 4 times higher than pure copper foil, which conforms to mainstream industrial performance standards. Under heavy gaming loads, it reduces chip hotspot temperature by 5-7℃ and controls back cover temperature difference within ±4℃. Custom profiling and partial hollowing are available to avoid shielding covers, fingerprint modules and camera components.
All vapor chambers pass national standard reliability tests including 5,000 bending cycles, -40℃~75℃ thermal cycling and long-term air tightness inspection, adapting to daily bending, temperature fluctuation and slight vibration without air leakage or performance degradation. Supported by in-house stamping, brazing and dust-free packaging production lines, we provide full-cycle services including thermal simulation, capillary structure adjustment and shape customization, covering sample verification and mass production. Our products are widely applied in flagship, foldable and slim fast-charging smartphones. Contact us for actual test data and customized solutions.