Foldable Smartphone Thermal Cooling


Pioneer Thermal ultra-thin vapor chambers adopt mature copper etching and powder capillary sintering technology. The standard mass production thickness ranges from 0.25mm to 0.35mm, with an ultra-thin limit of 0.22mm, matching compact stacking requirements of straight and foldable smartphones. Adopting internal working fluid phase-change heat transfer, its lateral heat spreading capacity is 3 to 4 times higher than pure copper foil, which conforms to mainstream industrial performance standards. Under heavy gaming loads, it reduces chip hotspot temperature by 5-7℃ and controls back cover temperature difference within ±4℃. Custom profiling and partial hollowing are available to avoid shielding covers, fingerprint modules and camera components.
All vapor chambers pass national standard reliability tests including 5,000 bending cycles, -40℃~75℃ thermal cycling and long-term air tightness inspection, adapting to daily bending, temperature fluctuation and slight vibration without air leakage or performance degradation. Supported by in-house stamping, brazing and dust-free packaging production lines, we provide full-cycle services including thermal simulation, capillary structure adjustment and shape customization, covering sample verification and mass production. Our products are widely applied in flagship, foldable and slim fast-charging smartphones. Contact us for actual test data and customized solutions.


