Heat Sink Metal Stamping Parts

Heat Sink Metal Stamping Parts

Stamped copper heat sinks are precision-made and structurally interlocked from integrated copper sheets. The densely arranged fins with cutouts facilitate the installation of other components. High-purity copper delivers outstanding thermal conductivity, and the interlocking structure reduces interfacial thermal resistance, making them ideal for compact air cooling of computing modules and RF components.
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Description

Dongguan Pioneer Thermal Technology Co., Ltd. is one of the leading manufacturers and suppliers of heat sink metal stamping parts in China. Please feel free to buy customized heat sink metal stamping parts made in China here from our factory. Welcome to contact us for quotation and free sample.

 

Product Description

 

Stamped copper heat sinks are precision-made and structurally interlocked from integrated copper sheets. The densely arranged fins with cutouts facilitate the installation of other components. High-purity copper delivers outstanding thermal conductivity, and the interlocking structure reduces interfacial thermal resistance, making them ideal for compact air cooling of computing modules and RF components.

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Product Features
 

Interlocked Stamped Copper Integrated Structure

Whole radiator formed by precision stamped copper sheets with mechanical interlock, no glue or loose assembly gaps, stable overall structural rigidity.

01

Dense Parallel Copper Fin Layout

Ultra-thin closely spaced copper fins expand heat exchange area greatly, boosting natural convection passive cooling efficiency.

02

Custom Pre-Cut Component Cutouts

Reserved rectangular cutouts on fin panels for PCB connectors, power chips and wiring routing, eliminate secondary cutting during equipment assembly.

03

High-Purity Copper Raw Material

Adopt oxygen-free copper with top-tier thermal conductivity, far superior heat transfer performance compared to standard aluminum heat sinks.

04

Built-In Mounting Lugs

Integrated stamped positioning tabs on base edge for fast screw fixation to motherboards, cabinets and heat source substrates.

05

 

 
Technical Specifications
 

Item

Standard Parameter

Custom Supported Range

Raw Material

C1100 High Purity Oxygen-Free Copper

C1020, copper alloy optional

Forming Process

Precision Metal Stamping + Interlock Assembly

Secondary CNC deburring, surface passivation

Fin Structure

Thin Parallel Interlocked Copper Fins

Custom fin thickness, height, spacing, density

Custom Features

Component Cutouts + Mounting Tabs

Adjust cutout size/position, add positioning holes, bend lugs

Surface Treatment

Natural copper passivation anti-tarnish

Nickel plating, tin plating for anti-oxidation

Tolerance Control

±0.02mm stamping precision

Custom overall length, width, thickness per customer drawings

Cooling Mode

Passive Natural Air Convection

Match small cooling fans for forced air cooling upgrade

 

 
Advantages
 
01/

Industry-Leading Thermal Conductivity

High purity copper thermal conductivity is nearly twice that of aluminum, rapidly extract concentrated heat from high-power chips to avoid overheating.

02/

Ultra-Low Interfacial Thermal Resistance

Mechanical interlock tightly combines all copper fins as one solid unit, no loose contact gaps; heat transfer loss far lower than welded/glued split heat sinks.

03/

Ultra-Compact Thin Flat Profile

Thin stamped copper sheet design saves vertical installation space, ideal for slim miniaturized electronic equipment with limited internal clearance.

04/

Pre-Designed Cutouts Reduce Assembly Work

Pre-reserved cutouts on fins skip on-site cutting process, shorten customer product assembly time and lower processing waste cost.

05/

Light & Rigid Integrated Body

Stamped interlock structure delivers stable shock resistance, thinner weight than solid copper block radiators without sacrificing cooling performance.

06/

Long Service Anti-Oxidation Option

Optional nickel/tin plating surface treatment prevents copper oxidation discoloration, stable performance for long-term continuous operation devices.

 

 
Applications
 

Computing Hardware

Mini ITX motherboards, server memory modules, embedded computing chips, SSD cooling radiatorss.

RF & Communication Equipment

RF power amplifiers, signal transceivers, base station small power modules, 5G communication components.

Industrial Control Electronics

Compact switching power supplies, drive control boards, industrial embedded single-board computers.

Consumer High Power Devices

Mini LED drivers, portable high-frequency power converters, medical compact sensor modules.

 

 
Manufacture Ability
 

1. Full-Automatic Precision Stamping Workshop

High-speed stamping machines support mass production of interlocked copper fin radiators, consistent dimensional accuracy for bulk orders.

2. One-Stop In-House Custom Processing

Complete full workflow: copper sheet blanking, fin stamping, interlock forming, cutout punching, mounting lug bending, deburring and surface anti-tarnish plating. No multi-supplier outsourcing required.

3. Flexible Sample & Mass Production Cycle

Fast prototype samples within 3 working days; flexible MOQ for R&D test batches, stable delivery schedule for large-volume mass orders.

4. Custom Structural Design Service

Our engineering team optimizes fin density, cutout layout and mounting tabs based on your heat power and cabinet space constraints; free structural simulation suggestions.

5. Strict Multi-Round Quality Inspection

100% dimensional tolerance check, interlock tightness test and surface defect screening before shipment; sampling thermal resistance testing to guarantee stable cooling performance.

 

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