Dongguan Pioneer Thermal Technology Co., Ltd. is one of the leading manufacturers and suppliers of vapor chamber heatsink in China. Please feel free to buy customized vapor chamber heatsink made in China here from our factory. Welcome to contact us for quotation and free sample.
Product Description
A vapor chamber heat sink is a cooling device that dissipate heat by spreading it over a larger surface area, so it can remove heat more efficiently.
In a vapor chamber heatsink, liquid coolant is sealed within a thin, flat chamber, when heat is applied to the chamber, the coolant evaporates and expands, spreading the heat over a larger surface area, as the vapor cools and condenses into a liquid, the heat is dissipated into the surrounding environment.
Core Features
Precision Formed Sealed Vapor Chamber Base
Manufactured on heavy-duty four-post & gantry deep drawing hydraulic presses, ultra-thin flat chamber walls achieve uniform thickness with zero micro-leakage. Fully hermetically sealed vacuum cavity prevents fluid loss for long-term stable performance.
01
High-Density Bonded Fin Stack Design
Vertical parallel fin arrays mechanically locked to vapor chamber substrate; enlarged convection surface boosts air heat exchange efficiency drastically. Custom fin height, spacing and thickness available per thermal load demands.
02
Premium Raw Material & Internal Wick Structure
Adopts high-purity aluminum/copper substrate with sintered metal powder wick inside the chamber. Optimized capillary structure accelerates condensed liquid backflow, sustaining continuous evaporation-condensation heat circulation cycle.
03
Custom Mounting & Assembly Structure
Precision CNC machined positioning studs, folded mounting flanges and locking notches pre-fabricated for direct bolt-on installation onto PCBs, power modules and battery packs. Flat contact surface ensures zero thermal interface gaps.
04
Surface Anti-Oxidation Treatment
Brushed metal finish with optional passivation, nickel plating or black anodization; resists corrosion, oxidation and dust buildup in industrial, automotive and consumer electronics operating environments.
05
Technical Specifications
|
Item |
Standard Specification |
Custom Range |
|
Chamber Base Thickness |
0.8mm–2.0mm |
0.5mm–3.0mm |
|
Overall Heatsink Dimension |
Custom cut-to-size |
Min 20×20mm / Max 600×400mm |
|
Working Fluid Medium |
Deionized purified coolant |
Water, methanol, specialized low-temperature fluid |
|
Operating Temperature Range |
0°C – 120°C |
-40°C to 180°C (fluid adjusted) |
|
Thermal Conductivity (Horizontal) |
>15,000 W/m·K |
Far exceeds pure copper (~401 W/m·K) |
|
Fin Height & Pitch |
10mm–50mm height, 2–5mm pitch |
Fully adjustable |
|
Vacuum Sealing Pressure |
High-vacuum internal cavity |
Industry-grade leak test certified |
|
Mounting Hardware |
Stainless steel positioning pins |
Threaded studs, snap flanges, clip brackets |
Competitive Advantages Over Conventional Heat Sinks
Unmatched Hotspot Elimination Speed
Phase-change heat transfer spreads heat hundreds of times faster than solid metal. Even concentrated heat loads (up to 1000W+ power) distribute uniformly across the entire heatsink fin stack, preventing localized overheating and component burnout.
Compact Lightweight Build Without Cooling Loss
Achieve superior cooling performance in a smaller footprint vs thick solid copper sinks; cuts overall device weight while maintaining robust structural rigidity from hydraulic deep drawing forming. Ideal for space-constrained high-density electronics.
In-House Full-Spectrum Manufacturing Control
We own the complete production chain: sheet metal blanking → hydraulic deep drawing chamber forming → sintered wick assembly → vacuum fluid filling → hermetic sealing → CNC precision machining → surface finishing → leak & thermal performance testing. No outsourced third-party processing, tighter quality control, shorter lead times and cost optimization for bulk orders.
Long Service Lifespan & Zero Maintenance
Fully sealed closed-loop system requires no refilling or upkeep. Rigorous helium leak testing ensures zero fluid evaporation over 8+ years continuous operation, outlasting cheaper poorly sealed generic vapor chamber sinks.
100% Customizable Thermal Tuning
Our engineering team modifies wick density, fluid volume, chamber thickness and fin layout to match exact wattage, airflow and enclosure constraints of your unique device design. Free thermal simulation support for prototype validation before mass production.
Applications
New Energy EV Power Modules & Battery Thermal Packs.
High-performance Server CPU/GPU, AI Accelerator Boards.
Automotive Inverters, On-Board Chargers (OBC).
Industrial High-Power LED Lighting & Laser Equipment.
Medical Imaging & Diagnostic Electronic Hardware,
Communication Base Station RF Power Amplifiers.
Portable Energy Storage Power Banks.
Manufacturing & Production Capabilit
Every vapor chamber heatsink starts with precision sheet metal deep drawing using our high-tonnage hydraulic presses (300T–800T four-post & gantry frame models). This deep drawing process molds flat metal sheets into uniform thin-walled chamber enclosures with consistent dimensional tolerance (±0.02mm flatness accuracy). Internal sintered wick structures are inserted before automated high-vacuum fluid injection and laser hermetic sealing. Post-sealing, CNC milling fabricates mounting posts, flanges and notches to match customer assembly drawings. Each unit undergoes multi-stage quality checks: helium leak detection, thermal resistance testing, dimensional inspection and surface finish verification before packaging and shipment. We support small-batch prototype runs to mass-volume OEM/ODM manufacturing for global electronics brands.
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