Dongguan Pioneer Thermal Technology Co., Ltd. is one of the leading manufacturers and suppliers of high performance vapor chamber cooler in China. Please feel free to buy customized high performance vapor chamber cooler made in China here from our factory. Welcome to contact us for quotation and free sample.
Product Description
Inside the sealed chamber, we usually put some copper pillars to reinforce the stiffness of the vapor chamber plate, and sinter some copper mesh or powder to build a wick structure which create a capillary force to drive the condensed liquid back to the heat source area. As the thermal medium is coolant, so we inject a small volume water into the chamber to evaporate and condense to absorb and transfer the heat from the electronic devices. The difference between the vapor chamber and heat pipe is that the vapor in the vapor chamber can spread to many direction, which means it can spread the heat much more efficient, which makes the vapor chamber heatsink to be a high performance thermal solution.
Product Parameter (Specification)
|
Parameter |
Value / Range |
|
Dimensions (L × W × H) |
Customizable (typical: 30×30×3 mm to 150×150×8 mm) |
|
Base Material |
Copper (C1100 or equivalent) |
|
Wick Structure |
Sintered copper mesh (100–200 mesh) or sintered copper powder (50–100 μm) |
|
Reinforcement |
Copper pillars (density and layout customizable) |
|
Working Fluid |
Deionized water |
|
Fluid Fill Volume |
10–30% of internal cavity volume |
|
Operating Temperature Range |
0°C to 120°C |
|
Maximum Power Handling |
Up to 500 W (depends on size and wick design) |
|
Thermal Resistance (Rth) |
0.05 – 0.2 °C/W (typical) |
|
Flatness |
≤ 0.05 mm over entire surface |
|
Thickness Variation |
±0.1 mm |
|
Leak Rate |
< 1×10⁻⁶ Pa·m³/s (helium leak test) |
Product Features
Key Features
Multi-Directional Heat Spreading
Vapor can travel in X and Y directions simultaneously, eliminating hot spots.
High Effective Thermal Conductivity
Reaches 5,000–20,000 W/m·K (equivalent to 10–40 times that of solid copper).
Thin And Light Weight
Can be as thin as 2 mm, ideal for compact electronics.
Excellent Structural Integrity
Copper pillars prevent chamber collapse under vacuum or external clamping force.
Passive Operation
No moving parts, no external energy input, maintenance-free.
Customizable Geometr
Can be produced in various shapes (rectangular, stepped, or with mounting holes).
Applications
High-Performance Computing
CPUs, GPUs, server processors.
Consumer Electronics
High-end smartphones, tablets, ultrabooks.
Power Electronics
IGBT modules, inverters, LED lighting.
Telecom & Networking
Base stations, RF power amplifiers.
Aerospace & defense
Avionics, radar systems where reliability and space constraints are critical.
Production Details
|
Process Step |
Description |
|
Shell & Pillar Fabrication |
Copper sheets are stamped or machined to shape; copper pillars are cut and positioned inside the lower plate. |
|
Wick Sintering |
Copper mesh or powder is deposited onto inner surfaces and sintered at high temperature (800–950°C) in a reducing atmosphere to form a porous layer. |
|
Pillar Bonding |
Pillars are diffusion-bonded or brazed to both plates during sintering, ensuring mechanical support. |
|
Sealing & Evacuation |
The two halves are welded (often by TIG or laser welding) except for a fill tube. The chamber is evacuated to high vacuum (≤10⁻⁵ torr). |
|
Fluid Injection |
Precisely measured deionized water is injected through the fill tube. |
|
Final Sealing |
The fill tube is crimped and sealed by cold welding or fusion. |
|
Aging & Testing |
Each unit undergoes thermal cycling (e.g., –40°C to 100°C for 10 cycles), leak testing, and performance validation. |
Product Qualification
To ensure reliability and performance, every vapor chamber heatsink meets or exceeds the following qualification standards:
|
Test Item |
Method/Condition |
|
Leak Integrity |
Helium mass spectrometry (leak detector) |
|
Thermal Performance |
Resistive heater + thermocouples; measure ΔT vs. power |
|
Mechanical Strength |
Compression test (simulating clamp force) |
|
Temperature Cycling |
100 cycles, –40°C ↔ 125°C, 30 min dwell each |
|
High Temperature Storage |
150°C for 1000 hours |
|
Vibration & Shock |
MIL-STD-883 (or JESD22) |
|
Flatness & Coplanarity |
Optical measurement after reflow simulation |
All products are 100% leak-tested and thermal-tested before shipment. Custom qualification plans can be developed based on customer application requirements.
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