Dongguan Pioneer Thermal Technology Co., Ltd. is one of the leading manufacturers and suppliers of chip heat sink in China. Please feel free to buy customized chip heat sink made in China here from our factory. Welcome to contact us for quotation and free sample.
Product Description
Chip heat sinks are compact cooling parts for semiconductor chips, commonly manufactured by aluminum extrusion, die casting or skived fin processes. Mounted with thermal paste or thermal pads on CPU, IC and power chips, they quickly conduct concentrated heat away from core components. Most items undergo anodization to improve corrosion resistance and radiant heat dissipation. Featured in diversified sizes for consumer electronics, industrial controllers and automotive chips, they effectively prevent overheating and chip performance degradation caused by thermal throttling.
Product Features
Superior Thermal Conductivity Aluminum Base
Adopts high-purity 6063 aluminum alloy as raw material, far surpassing generic alloy alternatives in heat conduction efficiency. Optimized fin spacing & thickness design maximizes air contact area, accelerating natural convection heat dissipation without bulky fan attachments for low-noise setups.
01
Full Custom Machining & Precision Holing
In-house CNC machining enables custom mounting holes, positioning pins, stepped edges and tailored fin profiles (matching the custom pin & hole layout shown on our sample heatsink). We match your PCB/chip footprint exactly to guarantee seamless, gap-free contact for maximum thermal transfer.
02
Protective Anodized Surface Finish
Uniform silver anodization resists oxidation, moisture and industrial chemical corrosion. The treated surface also elevates radiative heat transfer performance vs bare aluminum, extending product service life in harsh operating environments.
03
Robust Structural Stability
Integral one-piece extrusion construction eliminates weak bonded joints found in assembled fin heatsinks; rigid fin structure resists bending, vibration damage during assembly, shipping and long-term equipment operation.
04
Custom Size Flexibility For All Load Levels
From miniature compact sizes for small IC chips to heavy-duty large-format sinks for high-power industrial power modules, we tailor dimensions, fin height, base thickness to match your wattage heat load requirements perfectly.
05
Technical Specifications
|
Item |
Standard Specification |
Custom Options |
|
Base Material |
6063-T5 Extruded Aluminum Alloy |
6061 aluminum, copper composite inserts |
|
Surface Treatment |
Silver clear anodizing (10–15μm film thickness) |
Black anodize, sandblasting, passivation |
|
Manufacturing Process |
Aluminum Extrusion (main process) |
Die casting, skived fin, bonded fin |
|
Machining Tolerance |
±0.02mm for critical mounting dimensions |
Ultra-precision ±0.005mm tolerance for microchip applications |
|
Mounting Compatibility |
Supports thermal paste, thermal pad, spring clip fastener mounting |
Custom locating pins, threaded studs, L-shaped mounting flanges |
|
Thermal Performance |
Natural convection optimized; compatible with forced air fan cooling |
Fin density adjusted for high-watt heat dissipation |
Applications
Consumer Electronics
Motherboard CPUs, graphics chips, power supply ICs, audio amplifier chips, router & modem semiconductors.
Industrial Automation
PLC controllers, servo drive power chips, inverter modules, relay circuit boards, industrial sensor chips.
Automotive Electronics
Vehicle ECU chips, battery management system (BMS) semiconductors, LED drive power chips, on-board charging modules.
Power Equipment
Switch power supplies, DC-DC converter chips, rectifier power transistors, solar controller semiconductors.
Medical & Communication Devices
Medical control board ICs, telecom baseband chips, transceiver power semiconductors.
Advanced Processing & OEM/ODM Capacity
1. End-To-End In-House Production Chain
Full workflow control from aluminum billet extrusion, precision CNC milling/drilling/tapping, surface anodization, quality inspection to finished packaging. No outsourced intermediate processes to compromise tolerance or finish quality.
2. Flexible OEM & ODM Customization
We develop bespoke heatsink designs based on your thermal simulation reports, CAD drawings or physical chip samples. Our engineering team provides free thermal performance consultation to optimize fin layout and base thickness for your exact heat load.
3. Strict Quality Control Standards
100% dimensional inspection with calipers & coordinate measuring machines; thermal conductivity spot testing; salt spray corrosion testing for anodized finishes to validate long-term reliability.
4. Scalable Production Volume
Capable of small-batch prototype runs for R&D testing and mass high-volume bulk orders for large electronic manufacturers, with fast lead times to shorten your product launch timeline.
Why Our Chip Heat Sinks Beat Competitors
Custom pin, flange and hole configurations are produced in-house without third-party outsourcing, cutting lead times and extra markup costs.
Optimized extrusion fin geometry delivers 12–18% better natural convection cooling than generic equal-size competitor heatsinks.
Premium anodization thickness prevents premature rust in humid factory, automotive and outdoor electronics environments.
One-piece monolithic build eliminates fin detachment risks common with cheaper bonded-fin aftermarket alternatives.
Free engineering thermal analysis support included for all custom orders, a value-added service rarely offered by basic heatsink suppliers.
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