1. Efficient Heat Dissipation: Utilizes phase-change cycle technology for rapid heat conduction, effectively resolving issues where chips in devices like smartphones and computers overheat and throttle performance.
2. Uniform Heat Conduction: Employs heat diffusion technology to evenly distribute localized high temperatures, keeping the device's surface temperature variation within 10°C and eliminating hotspots.
3. Space Optimization: Features an ultra-thin 0.22mm design that perfectly fits slim devices-such as foldables-offering greater flexibility for internal component layout.
4. Performance Assurance: Ensures sustained, stable heat dissipation to allow chips to operate at full load, significantly improving gaming frame rate stability and extending battery life.
