In addition to sintering and copper mesh, key methods for fabricating the 2D heat-dissipating capillary structures of vapor chambers (VCs) include grooving and the use of metal thin films. From a technical standpoint, R&D efforts remain focused on further reducing thermal resistance and enhancing thermal conductivity to enable compatibility with lighter heat sink fins, such as those made of aluminum. Regarding manufacturing, the industry is prioritizing higher production yields and cost reductions for overall thermal management solutions. In terms of application, vapor chambers have already evolved beyond the one-dimensional heat transfer of heat pipes to two-dimensional heat spreading; new solutions are currently under development to address other potential thermal management needs. Pragmatically, the immediate priority for vapor chamber manufacturers is expanding the market for existing products.
For instance, in the foldable smartphone sector, vapor chambers made from materials such as copper, stainless steel, steel-copper composites, aluminum alloys, and titanium are already being mass-supplied to leading domestic and international clients. Furthermore, a smartphone released in May 2026 featured a "7K" liquid-cooling vapor chamber. Leaked information from July 2026 indicates that the Apple iPhone 18 Pro series utilizes a vapor chamber for thermal management, with the A20 Pro chip designed to make direct contact with the chamber to minimize thermal resistance and improve heat dissipation under heavy loads. Meanwhile, in the realm of liquid-cooled servers for data centers, vapor chambers (including standard VCs and 3D VCs) have entered the stage of large-scale commercialization and continuous mass delivery.
Looking ahead, thermal management architectures will evolve alongside logic-folding technologies, shifting from unidirectional heat flow management to the coordinated allocation of vertical thermal budgets. Key directions with high engineering feasibility include embedded micro-channel liquid cooling driven by backside power delivery and the control of thermal resistance at bonded interfaces. In terms of material innovation, diamond-silicon carbide composites represent a critical breakthrough area. Key avenues for advancement in thermal management technology include material innovation, package-level micro-channel liquid cooling, and system-level liquid cooling.
