Recently, Pioneer Thermal officially launched the new large-size 3D-Vapor Chamber (3D-VC), which is specially developed to solve heat dissipation difficulties for high-power LED stage lights and professional film lights, delivering high-performance thermal management solutions for the industry.
Professional light chips over 2000W generate intense heat. Traditional heat dissipation solutions fail to distribute heat evenly, resulting in local overheating. It will further lead to light decay, color deviation and even equipment breakdown.
Our new 3D-VC features a large size of 260×220mm, fully covering the heat dissipation area of high-power chips. The innovative all-copper 3D column structure forms a 3D heat conduction network, breaking the performance limit of traditional flat vapor chambers. It transfers heat rapidly and evenly across the entire surface and eliminates local overheating fundamentally.
For high-load scenarios such as stage performances and film shooting, this product keeps core chips working at a stable temperature. Even under long-term high-intensity operation, the lights maintain steady brightness and pure color without strobing or brightness loss, ensuring smooth operation of performances and shooting work.
With outstanding thermal performance, this new product greatly improves the stability and service life of high-power lighting equipment, and provides reliable heat dissipation accessories for lighting manufacturers worldwide.
